The miniaturization of high-voltage pulse generators is critical for emerging portable and integrated applications, particularly in the advanced electro-physical processing of textiles and leather. Traditional planar printed circuit board (PCB) designs face fundamental limitations in size and parasitic performance. This work presents the design, fabrication, and experimental validation of an ultra-compact, multi-layer stacked solid-state high-voltage pulse generator. The module integrates a flyback boost converter using a low-temperature co-fired ceramic (LTCC) transformer, an energy storage capacitor, and a MOS-controlled thyristor (MCT) switch within a 15.0×15.0×15.7 mm³ volume. A vertical stacking architecture separates low-voltage control from high-voltage discharge layers, minimizing the commutation loop. Electrostatic simulations confirm insulation integrity at 1.2 kV, while electromagnetic extraction shows a total loop inductance of 45.35 nH. Experimental results demonstrate a steady boost to 1.18 kV and a peak discharge current of 2.016 kA with an underdamped oscillatory waveform. The prototype validates the multi-layer stacking methodology as a viable path toward high-density, integrated pulsed power systems tailored for modern, compact material treatment equipment.

multi-layer stacking, solid-state pulse generator, high-voltage miniaturization